Datacenters
Buffers server-rack hotspots and transient loads, smoothing temperature spikes and helping
protect uptime and hardware life.
A Proven Technology, Reinvented for the Next Generation of Energy Systems
Phase Change Materials (PCMs) have been applied for decades as a powerful way to manage heat.
NASA pioneered their use in missions where precise thermal control can determine success or failure.
At Zero Point Energy Labs, we’ve engineered proprietary PCM modules for the extreme demands of today’s
energy, aerospace, defense, and microelectronics applications.
What Are Phase Change Materials?
PCMs absorb and release thermal energy during melting and solidifying.
Unlike materials that simply heat up, PCMs undergo a phase transition (solid ↔ liquid),
storing large amounts of energy with minimal temperature rise.
Absorption — As heat is generated, the PCM absorbs energy and transitions from solid to liquid.
Release — When the load drops, the PCM releases stored heat slowly and re-solidifies,
preventing thermal spikes.
How It Works in Practice
Integrated into a battery pack, RF device, or sensitive microelectronics, our PCM modules act as a
thermal buffer:
Rapid Absorption — Captures excess heat that would otherwise degrade performance,
reduce lifespan, or distort RF transmission.
Thermal Delay — Stores energy during phase change, keeping the system inside
a stable operating band.
Gradual Release — When output drops, the PCM releases heat slowly and re-solidifies,
ready for the next cycle.
PCMs are especially valuable in systems with intermittent duty cycles, where bursts of high power are followed by lower-power or idle phases.
Applications Beyond Batteries
RF & Communications
Reduces IR-driven losses and drift for more stable transmission characteristics.
Microelectronics
Buffers transient heat spikes to protect delicate ICs and precision components.
Cryogenic Systems
Stabilizes low-temperature operation where thermal swings are costly.
Ongoing R&D
PCM systems assume heat will eventually drop so the material can re-solidify.
For continuous high-heat devices, that’s the core challenge.
We pair our PCM modules with high-performance thermal interface materials (TIMs) to spread heat during
extended operation, and we’re developing next-gen PCM composites to improve resilience under sustained loads.
Technical Documentation
Safety Data Sheet (SDS)
General safety & handling for all PCM compositions.
∆MC555C Datasheet
Specifications and integration notes.
Additional compositions are in testing — more datasheets coming soon.
